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| CATALOG |
5031590400 COUNTRY OF ORIGIN
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5031590400 PARAMETRIC INFO
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5031590400 PACKAGE INFO
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5031590400 MANUFACTURING INFO
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5031590400 PACKAGING INFO
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5031590400 ECAD MODELS
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COUNTRY OF ORIGIN
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China
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| Japan |
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PARAMETRIC INFO
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| Type |
Wire to Board |
| Gender |
RCP |
| Number of Contacts |
4 |
| Termination Method |
Solder |
| Tradename |
CLIK-Mate |
| Maximum Current Rating (A) |
2/Contact |
| Maximum Voltage Rating |
100V |
| Housing Material |
Polyamide |
| Housing Color |
Beige |
| Contact Material |
Copper Alloy |
| Contact Plating |
Tin Over Nickel |
| Number of Rows |
1 |
| Maximum Contact Resistance (mOhm) |
20 |
| Polarization Type |
Dual Slot |
| Wire Size (AWG) |
24-30 |
| Insulation Resistance (MOhm) |
500 |
| Operating Temperature (°C) |
-40 to 105 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Mating Cycle (Cycles) |
30 |
| Minimum Storage Temperature (°C) |
-40 |
| Maximum Storage Temperature (°C) |
85 |
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PACKAGE INFO
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| Terminal Pitch (mm) |
1.5 |
| Body Orientation |
Straight |
| Mounting |
Through Hole |
| Product Length (mm) |
8.9 |
| Product Depth (mm) |
6.55 |
| Product Height (mm) |
7.95 |
| Product Weight (g) |
0.433801 |
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MANUFACTURING INFO
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| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Maximum Wave Temperature (°C) |
N/A |
| Wave Solder Time (Sec) |
N/A |
| Lead Finish(Plating) |
Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging |
Tray |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
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