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• Internally Organized as 128 x 8 (1K) or 256 x 8 (2K)
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• Schmitt Trigger, Filtered Inputs for Noise Suppression
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• Bidirectional Data Transfer Protocol
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• 400kHz (1.7V) and 1MHz (2.5V, 2.7V, 5.0V) Compatibility
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• Write Protect Pin for Hardware Data Protection
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| CATALOG |
AT24C02C-SSHM-T COUNTRY OF ORIGIN
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AT24C02C-SSHM-T PARAMETRIC INFO
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AT24C02C-SSHM-T PACKAGE INFO
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AT24C02C-SSHM-T MANUFACTURING INFO
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AT24C02C-SSHM-T PACKAGING INFO
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AT24C02C-SSHM-T ECAD MODELS
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COUNTRY OF ORIGIN
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China
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| Philippines |
| Thailand |
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PARAMETRIC INFO
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| Density (bit) |
2K |
| Interface Type |
Serial-I2C |
| Maximum Operating Frequency (MHz) |
1 |
| Maximum Access Time (ns) |
550 |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3|5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Maximum Cycle Time (s) |
5m |
| Programmability |
Yes |
| I/O Mode |
Serial |
| Density in Bits (bit) |
2048 |
| Maximum Supply Current (mA) |
3 |
| Hardware Data Protection |
Yes |
| Organization |
256x8 |
| Data Retention (Year) |
100 |
| Minimum Operating Supply Voltage (V) |
1.7 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Number of Bits per Word (bit) |
8 |
| Address Bus Width (bit) |
3 |
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PACKAGE INFO
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| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
4.98(Max) |
| Package Width (mm) |
3.99(Max) |
| Package Height (mm) |
1.48(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4.98(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.73(Max) |
| Seated Plane Height (mm) |
1.73(Max) |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.51(Max) |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_L (mm) |
4.98 |
| Minimum PACKAGE_DIMENSION_L (mm) |
4.8 |
| Maximum PACKAGE_DIMENSION_W (mm) |
3.99 |
| Minimum PACKAGE_DIMENSION_W (mm) |
3.81 |
| Maximum Diameter (mm) |
N/R |
| Minimum Diameter (mm) |
N/R |
| Minimum Seated_Plane_Height (mm) |
1.35 |
| Minimum PACKAGE_DIMENSION_H (mm) |
1.25 |
| Maximum PACKAGE_DIMENSION_H (mm) |
1.48 |
| Maximum Seated_Plane_Height (mm) |
1.73 |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
4000 |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
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