SN74HC573ADWR Texas Instruments IC OCT D-TYPE LATCH 20-SOIC

label:
2023년8월17일 244



CATALOG
SN74HC573ADWR COUNTRY OF ORIGIN
SN74HC573ADWR PARAMETRIC INFO
SN74HC573ADWR PACKAGE INFO
SN74HC573ADWR MANUFACTURING INFO
SN74HC573ADWR PACKAGING INFO
SN74HC573ADWR ECAD MODELS


COUNTRY OF ORIGIN
Malaysia


PARAMETRIC INFO
Type D-Type
Latch Mode Transparent
Bus Hold No
Logic Family HC
Process Technology CMOS
Number of Elements per Chip 1
Number of Channels per Chip 8
Number of Inputs per Chip 8
Number of Outputs per Chip 8
Number of Output Enables per Element 1
Number of Input Enables per Element 1
Number of Selection Inputs per Element 0
Output Type 3-State
Polarity Non-Inverting
Set/Reset No
Minimum Operating Supply Voltage (V) 2
Maximum Operating Supply Voltage (V) 6
Typical Operating Supply Voltage (V) 5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Maximum Propagation Delay Time @ Maximum CL (ns) 200@2V|40@4.5V|34@6V
Absolute Propagation Delay Time (ns) 285
Propagation Delay Test Condition (pF) 150
Maximum High Level Output Current (mA) -7.8
Maximum Low Level Output Current (mA) 7.8
Maximum Quiescent Current (uA) 8


PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 20
Lead Shape Gull-wing
PCB 20
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 13(Max)
Package Width (mm) 7.6(Max)
Package Height (mm) 2.35(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 13(Max)
Package Overall Width (mm) 10.63(Max)
Package Overall Height (mm) 2.65(Max)
Seated Plane Height (mm) 2.65(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec MS-013AC
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 2000
Reel Diameter (in) 13
Reel Width (mm) 24.4
Tape Pitch (mm) 12
Tape Width (mm) 24
Component Orientation Q1
Packaging Document Link to Datasheet


ECAD MODELS

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